发明名称 INJECTION MOLD HEATING APPARATUS
摘要 PURPOSE: An injection mold heating device is provided to reduce the total thickness of a mold by preventing the formation of thermal pattern due to sudden temperature increase. CONSTITUTION: An injection mold heating device comprises a square plate-shaped body(20) and a heating line(30). The main body is fixed adjacently to at least one cavity of the upper mold or lower mold. A plurality of heating line insertion holes(21) is formed in the inner side of the square plate-shaped body . The heating line is arranged along the heating line insertion hole. The heating line heats the domain of the cavity.
申请公布号 KR20110067669(A) 申请公布日期 2011.06.22
申请号 KR20090124361 申请日期 2009.12.15
申请人 KIM, MI SUK 发明人 KIM, MI SUK
分类号 B29C45/73;B29C45/72 主分类号 B29C45/73
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