| 摘要 |
<p>The method of producing an electrical contact pad comprising a support pad and a contact layer, comprises depositing a first powder (1) on the support pad to form the contact layer by cold gas dynamic spraying. The first powder containing particles comprises grains (10-40 vol.%) of a refractory material embedded in a matrix based on the conductive metal including silver or copper, pure metal particles corresponding to the conductive metal matrix, and particles comprising grains of a doping agent embedded in a metal matrix, which corresponds to the metal conductive metal matrix. The method of producing an electrical contact pad comprising a support pad and a contact layer, comprises depositing a first powder (1) on the support pad to form the contact layer by cold gas dynamic spraying. The first powder containing particles comprises grains (10-40 vol.%) of a refractory material embedded in a matrix based on the conductive metal including silver or copper, pure metal particles corresponding to the conductive metal matrix, and particles comprising grains of a doping agent embedded in a metal matrix, which corresponds to the metal conductive metal matrix. The doping agent is embedded with grains of refractory material in their matrix of conductive metal. The particles comprising grains of refractory material are obtained by the process including physical vapor deposition, chemical vapor deposition and electroless process, and by chemical precipitation on particles in suspension. The contact support is present in the form of precut individual pieces. Independent claims are included for: (1) a method for producing an electrical contact comprising a contact support and a pad; (2) an electrical contact; and (3) an electrical contact pad.</p> |
