| 摘要 |
<p>PURPOSE: A device and method for processing the surface of a semiconductor substrate are provided to form a water repellent protection film on a substrate, thereby preventing collapse of a micro pattern during a drying process. CONSTITUTION: A holding unit holds a semiconductor substrate with a convex pattern. A liquid solution supply unit(103) supplies a chemical solution onto the semiconductor substrate to perform cleaning and oxidation. A pure water supply unit(104) supplies pure water onto the semiconductor substrate to rinse the semiconductor substrate. A water repellent supply unit(106) supplies a water repellent onto the semiconductor substrate to form a water repellent protection film on the convex pattern. A drying unit dries the semiconductor substrate. An elimination unit eliminates the water repellent protection film except for the convex pattern.</p> |
