| 摘要 |
PURPOSE: A wafer level chip scale package and its fabrication method are provided to prevent the deterioration of a device by installing a refrigerant layer inside a passivation layer in a region excluding a device reserved area. CONSTITUTION: A first passivation layer(216) is formed in upper part of a structure in which the semiconductor device is formed. A refrigerant layer(218) is formed inside the first passivation layer. A refrigerant is inserted in a region excluding a device reserved area. A second passivation layer(220) is formed on the first passivation layer including the refrigerant layer. A refrigerant layer receives the refrigerant by forming the first passivation layer in a refrigerant input hole through a dry etching process. The first passivation layer and the second passivation layer are formed by using glass. |
