APPARATUS FOR CUTTING SUBSTRATE USING LASER

摘要

PURPOSE: A glass substrate cutting processor using a laser is provided to form a scribing line with the uniform focus depth by fixing the location of a laser beam and rotating a glass substrate. CONSTITUTION: A glass substrate cutting processor using a laser comprises the following: an index table(100) including plural rotating rods(120) combined with the index tale with constant intervals for mounting glass substrates; an index driving unit(110) separately rotating the index tale into the predetermined angle; a main laser unit(200) irradiating a laser bean to one fixed point on the index table mounted on the upper side of the main laser unit; a rod driving unit diving the rotating rods; and a controller(600) controlling the operation the main laser unit and the rod driving unit.