Method of texturing silicon wafer for fabricating solar cells

摘要

The method involves placing a silicon wafer (3) in a texturing solution (7), which exhibits temperature of eighty degrees Celsius and consists of water, which is displaced with one weight percentage up to six weight percentage potassium hydroxide or two weight percentage up to eight weight percentage sodium hydroxide. Concentration of tenside and/or tenside mixture in the texturing solution is extremely small i.e. less than 0.01 weight percentage.