| 摘要 |
<p>Use of a heat curing epoxide composition comprising at least one epoxy resin A with an average more than one epoxide group per molecule; at least one curing agent for epoxy resin B, which is activated by an increased temperature; and metallic particles (5) with an average particle size of 50-3000 mu m as a crimping fold adhesive, is claimed. Independent claims are also included for: (1) producing the crimping fold adhesive, comprising (a) applying the heat curing epoxide composition to an inner panel (3) or to an outer panel (2), (b) contacting the heat curing epoxide composition (4) with the outer panel or the inner panel, (c) crimping the outer panel to the inner panel, so that the interior space of the crimping fold is provided with the heat curing epoxide composition, (d) pressing the crimping fold, and (e) introducing thermal energy into the heat curing epoxide composition; and (2) the crimping fold adhesive by the above mentioned method.</p> |
