| 摘要 |
PURPOSE: A resin composition is provided to form a plated conductor layer having a sufficient peel strength in a wet roughing step and to ensure excellent dielectric characteristics and coefficient of thermal expansion. CONSTITUTION: A resin composition comprises (A) a cyanate ester resin and (B) a naphthylene ether type epoxy resin. When a non-volatile matter content in the resin composition is defined as 100% by mass, a content of the cyanate ester resin(A) is from 2 to 50% by mass, and a content of the naphthylene ether type epoxy resin(B) is from 1 to 40% by mass. The resin composition further comprises (C) an inorganic filler, (D) a curing accelerator, (E) an epoxy resin (exclusive of the naphthylene ether type epoxy resin), and (F) an active ester curing agent. |
