| 摘要 |
956,079. Semi-conductor devices. INTERNATIONAL ELECTRONIC RESEARCH CORPORATION. Feb. 15, 1962 [Nov. 21, 1961], No. 5796/62. Heading H1K. [Also in Division E2] A heat dissipator for a transistor is of sheet metal and comprises a flange 20 (Figs. 1, 2), and spaced resilient legs 13 for gripping the transistor. The legs 13 each include a portion which extends inwardly at an oblique angle to the axis of the dissipator and a tip 18 which extends outwardly at an oblique angle to the axis. The dissipator has a skirt 11, although this may be omitted, Fig. 3, not shown. The legs are spaced apart by a distance less than the width of a leg. The flange is divided into segments by slits 27 and successive segments are bent upwardly and downwardly to create turbulence in convection currents flowing around the dissipator. Alternatively each segment is given a slight twist to separate adjacent edges. Flange 20 has an outer diameter approximately twice that of the skirt 11. When located on transistors 16, 17 (Fig. 4) on a printed circuit board 35, flanges 20 of two dissipators are at different heights so that one overlies the other and one also overlies another component 36. |
