PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A package substrate for an optical element and manufacturing method thereof are provided to eliminate a plugging process which fills epoxy in the empty space of a via, thereby simplifying the manufacturing processes of a package substrate for an optical element. CONSTITUTION: A first circuit layer(120) is formed on a base substrate and comprises a mounting part. An optical element(130) is mounted in the mounting part. A trench is formed by eliminating a first circuit layer by a fixed pattern surrounding the mounting part so that the first circuit layer is conductively connected to the optical element. A fluorescent resin is applied on an optical element with the trench as a boundary. A second circuit layer(160) is separated from the first circuit layer and is formed on the base substrate. A wire electrically connects the second circuit layer with the optical element.