| 摘要 |
PURPOSE: An electroplating apparatus for a substrate is provided to prevent contamination of a substrate by cleaning a contactor and prevent the leakage of plating liquid by completely draining plating liquid from a plating bath. CONSTITUTION: An electroplating apparatus for a substrate comprises a substrate supporting unit(3), an anode plate(5), a power supply, and a plating liquid supply unit(7). The substrate supporting unit supports a substrate(W) with a plated surface facing upward. The anode plate is arranged on the top of the substrate supporting unit. The power supply applies voltage to the anode plate and the substrate supported with the substrate supporting unit. The plating liquid supply unit supplies plating liquid to the substrate.
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