| 摘要 |
The present disclosure describes a unique pin configuration for mounting of circuit packages to corresponding host circuit boards. For example, an apparatus according to embodiments herein comprises a circuit, a substrate, and multiple conductive leads. The substrate has a surface on which the circuit (e.g., an integrated circuit) is mounted. The multiple conductive leads extend, in an orthogonal manner relative to the surface, through the substrate to electrically connect the circuit to a host circuit board. According to one embodiment, each respective conductive lead of the multiple conductive leads has been altered to produce a contact element (e.g., an L-shaped bend, J-shaped bend, etc.) at an axial end of the respective conductive lead opposite the substrate to solder the axial end of the respective conductive lead (i.e., contact element) to a surface mount pad of the host circuit board.
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