发明名称 Electronic device with flip module having low height
摘要 An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
申请公布号 US7965520(B2) 申请公布日期 2011.06.21
申请号 US20070625426 申请日期 2007.01.22
申请人 SONY ERICSSON MOBILE COMMUNICATIONS AB 发明人 BYGDOE HAAKAN;HOLMBERG PER
分类号 H05K9/00 主分类号 H05K9/00
代理机构 代理人
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