发明名称 Electromagnetic bandgap structure and printed circuit board
摘要 An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
申请公布号 US7965521(B2) 申请公布日期 2011.06.21
申请号 US20080010558 申请日期 2008.01.25
申请人 SAMSUNG ELECTRO-MECHANTICS CO., LTD. 发明人 HAN MI-JA;KIM HAN;PARK DAE-HYUN;LEE JAE-JOON
分类号 H05K9/00 主分类号 H05K9/00
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