| 发明名称 |
Method and apparatus for manufacturing electronic integrated circuit chip |
| 摘要 |
A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the assembly during a cure process.
|
| 申请公布号 |
US7964444(B2) |
申请公布日期 |
2011.06.21 |
| 申请号 |
US20070675445 |
申请日期 |
2007.02.15 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SRI-JAYANTHA SRI M. |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
