发明名称 |
Circuit substrate, circuit device and manufacturing process thereof |
摘要 |
A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.
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申请公布号 |
US7964957(B2) |
申请公布日期 |
2011.06.21 |
申请号 |
US20080342363 |
申请日期 |
2008.12.23 |
申请人 |
SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD. |
发明人 |
NOGUCHI MITSURU;TAKAKUSAKI SADAMICHI |
分类号 |
H01L23/24 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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