发明名称 High frequency module
摘要 A high frequency module includes a layered substrate and an element for outputting a reception signal in a balanced state. The element includes a first and a second output terminal and is mounted on the top surface of the layered substrate. A first and a second reception signal terminal are disposed on the bottom surface of the layered substrate. The high frequency module further includes a first signal path connecting the first output terminal and the first reception signal terminal to each other, and a second signal path connecting the second output terminal and the second reception signal terminal to each other. The first and second signal paths are each formed using one or more through holes provided inside the layered substrate, and are not exposed at any side surface of the layered substrate.
申请公布号 US7965989(B2) 申请公布日期 2011.06.21
申请号 US20080073257 申请日期 2008.03.03
申请人 TDK CORPORATION 发明人 IWATA MASASHI
分类号 H04B1/44 主分类号 H04B1/44
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