发明名称 Display device comprising a semiconductor chip including a first terminal which overlaps a first and second line, the first terminal connected to the first line and overlapping and insulated from the second line
摘要 The present invention provides a display device which, in a region on which a semiconductor chip is mounted, can narrow the distance between neighboring line layers and, at the same time, can increase an area of terminals which are connected with bump electrodes of the semiconductor chip. In a display device which includes a substrate having a display part and a peripheral portion, and a semiconductor chip which is mounted on the peripheral portion of the substrate, the semiconductor chip includes a first bump electrode, the substrate includes a first line, a second line which is arranged adjacent to the first line, an insulation film which covers the first line and the second line, a first contact hole which is formed in the insulation film, and a first terminal which is connected to the first line via the first contact hole, the first bump electrode is connected with the first terminal, the second line is electrically insulated from the first terminal, and the first terminal is arranged to overlap the second line by way of the insulation film as viewed in a plan view.
申请公布号 US7965368(B2) 申请公布日期 2011.06.21
申请号 US20070772274 申请日期 2007.07.02
申请人 HITACHI DISPLAYS, LTD. 发明人 TAKAHASHI HIROYUKI
分类号 G02F1/1345;H01L23/48 主分类号 G02F1/1345
代理机构 代理人
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