ETCHING METHOD AND MANUFACTURING METHOD FOR PCB USING THE SAME
摘要
PURPOSE: An etching method and a circuit board manufacturing method using the same are provided to be capable of forming a fine circuit pattern. CONSTITUTION: An etching target is provided(S110). An etching resist is laminated where a fuse pattern and a slit cutting the fuse pattern are formed at the etching target(S120). A fuse in accordance with the fuse pattern is formed, and the etching target is etched until the fuse exposed by the slit is cut(S130).
申请公布号
KR101042590(B1)
申请公布日期
2011.06.20
申请号
KR20090135735
申请日期
2009.12.31
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, JIN UK;CHOI, CHANG HWAN;LEE, DONG HWAN;LEE, WOO JIN