STACK BOARD FOR STACK OF SEMICONDUCTOR DEVICE PACKAGE

摘要

PURPOSE: A stack board for stacking a semiconductor device package is provided to firmly attach a lower layer semiconductor device package and an upper layer semiconductor device package using a compressive plate. CONSTITUTION: A stacking plate(100) includes a hollow package stack pocket(130). A compressive plate(200) includes a pusher(230) which is inserted into the package stack pocket of the stacking plate. A stacking part(125) is formed at the lower end part of an inclined guide side(123). A lower layer semiconductor device package(10) and an upper layer semiconductor device package(20) are successively loaded along the vertical loading side of the stacking part.