发明名称 JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A junction structure and a manufacturing method thereof are provided to maintain the strength of a joint part in high-temperature environment using glass. CONSTITUTION: A junction structure comprises a first member and a second member. The first and second members are bonded using solder and glass. The soldering is covered by the glass. The first and second members comprise conductor layers(2,6,7). The conductor layers are bonded in an area where the first and second members are bonded. The conductor layers are composed of one of Cu or Cu alloy, Al or Al alloy, Ni or Ni alloy, and Au or Au alloy.</p>
申请公布号 KR20110066855(A) 申请公布日期 2011.06.17
申请号 KR20100119615 申请日期 2010.11.29
申请人 KABUSHIKI KAISHA HITACHI SEISAKUSHO(D/B/A HITACHI, LTD.) 发明人 SAKAMOTO EIJI;HATA SHOHEI
分类号 B23K1/20;H01L23/08;H05K3/34 主分类号 B23K1/20
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