发明名称 LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING APPARATUS HAVING THE SAME
摘要 <p>PURPOSE: A light emitting device package and a light emitting apparatus having the same are provided to easily emit heat from a light-emitting device chip through a heat radiation member and a heat radiation plate by inserting the heat radiation plate or forming a heat radiation member to be directly contacted the device. CONSTITUTION: A molding unit(100) forms the body of a light-emitting diode package(30) together with a lead frame(200). The molding unit comprises a cavity(110) accommodating the light emitting diode chip(300). A heat radiation member(210) is projected from the bottom of the molding unit. A lead electrode(230) is electrically connected to the light-emitting device chip. A holder(240) is extended from the lead electrode.</p>
申请公布号 KR20110066795(A) 申请公布日期 2011.06.17
申请号 KR20090123586 申请日期 2009.12.11
申请人 LG DISPLAY CO., LTD. 发明人 JANG, JUN WOO;LEE, DON GYOU
分类号 H01L33/62 主分类号 H01L33/62
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