SPUTTERING APPARATUS

摘要

PURPOSE: A sputtering apparatus is provided to uniformly and stably deposit metallic catalysts with extremely low density in amorphous silicon by positioning a magnetic assembly only in an area where a free-sputtering process is performed. CONSTITUTION: A sputtering apparatus comprises a process chamber(110), a metal target(120), a target transfer unit(130), a substrate holder(140), and a magnetic assembly. The process chamber comprises first and second areas. The metal target is located inside the process chamber. The target transfer unit moves the metal target from the first area to the second area. The substrate holder is located at the second area to face with the metal target. The magnetic assembly is located between the target transfer unit in the first area and the process chamber.