发明名称 |
SUBSTRATE FOR ELECTRONIC DEVICE, LAMINATED BODY FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: A substrate for electronic device, a laminated body for electronic device, an electronic device, and manufacturing method thereof are provided to prevent a substrate from being misaligned by applying magnetic attractive force between the magnetic thin-films of a laminated substrate. CONSTITUTION: A functional layer(2) having a semiconductor circuit(6) is laminated on substrate(WF1~WFr). Substrate comprises a plurality of conductors(3) and a magnetic thin-film(41). A plurality of conductors is functioned as a connecting wire of a semiconductor circuit. The magnetic thin-film is formed in the outside of the conductors. An adhesive layer(42) is attached in the surface of the magnetic thin-film.</p> |
申请公布号 |
KR20110066866(A) |
申请公布日期 |
2011.06.17 |
申请号 |
KR20100125607 |
申请日期 |
2010.12.09 |
申请人 |
NAPRA CO., LTD. |
发明人 |
SEKINE SHIGENOBU;SEKINE YURINA;KUWANA YOSHIHARU |
分类号 |
H01L25/065;H01L23/045;H01L23/48 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|