发明名称 METHOD FOR CUTTING A MATERIAL LAYER BY MEANS OF A CUTTING BEAM
摘要 <p>In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.</p>
申请公布号 CA2725277(A1) 申请公布日期 2011.06.17
申请号 CA20102725277 申请日期 2010.12.14
申请人 MICROMACHINING AG 发明人 MAURER, WALTER
分类号 B26F3/00;B23K26/38;B23Q16/00;B24C1/04 主分类号 B26F3/00
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