| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily and speedily cope with a model change without using a die, and to easily manufacture a photo interrupter. <P>SOLUTION: An infrared LED 12 and a photo transistor 13 are die-bonded to a substrate 11 and connected by a gold wire 14. A region on the substrate 11 which includes them is sealed with optically transparent resin 15. A light shielding groove 18 and a groove 19 for peripheral a light shielding wall are formed by leaving a light guide 17 by cutting the optically transparent resin 15, and the whole periphery of the optically transparent resin 15 including the grooves 18 and 19 is sealed with light shielding resin 21. Resin between the infrared LED 12 and the photo transistor 13 is cut along a light shielding groove center line 100. Thus, a detection object passing space 22 of a recessed groove is formed and an emission window 17a and an incidence window 17b are formed with respect to the light guide 17. Finally, the photo interrupters 24 are manufactured in pieces. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
