发明名称 |
SYSTEM AND METHOD OF PREVENTING PATTERN COLLAPSE USING LOW SURFACE TENSION FLUID |
摘要 |
A system for processing a wafer with a low surface tension liquid includes a low surface tension liquid source including a first heat source capable of heating the low surface tension liquid to not more than 25 degrees C. less than boiling point of the low surface tension liquid, a delivery mechanism for delivering the heated low surface tension liquid to an air/liquid interface region and a second heat source directed toward the air/liquid interface region, the second heat source capable of heating the air/liquid interface region to at least 2 degrees C. greater than the boiling point of the low surface tension liquid. A method for processing a wafer with a low surface tension liquid is also described.
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申请公布号 |
US2011139183(A1) |
申请公布日期 |
2011.06.16 |
申请号 |
US20100965828 |
申请日期 |
2010.12.11 |
申请人 |
MIKHAYLICHENKO KATRINA;SYOMIN DENIS;WILCOXSON MARK |
发明人 |
MIKHAYLICHENKO KATRINA;SYOMIN DENIS;WILCOXSON MARK |
分类号 |
B08B3/00;B08B7/04 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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