| 摘要 |
A semiconductor package includes a semiconductor chip and a passive element. The semiconductor chip has a semiconductor chip s body which possesses a first surface and a second surface facing away from the first surface, and a circuit section is formed in the semiconductor chip body. The passive element includes passive element bodies which are disposed in through-electrodes passing through the semiconductor chip body and connection members to which are disposed on at least one of the first surface and the second surface of the semiconductor chip body and which electrically connect to at least one of the passive element bodies.
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