| 摘要 |
The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production. Besides, the laminate material and copper cladded laminate of the present invention, which are made from the above mentioned epoxy resin compound, are used in printed circuit boards to have good heat resistance, dielectric property, and machinability, so as to be good for the signal transmission of a high-frequency PCB.
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