| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a MEMS, a method for sealing a semiconductor element such as the MEMS, a method for forming a cavity and an associated element. <P>SOLUTION: This method of manufacturing the semiconductor element includes preparing a substrate having a non-flat three-dimensional shape and having a main surface including a substantial topography variation and forming a first cap layer having an upper surface and an under surface on the main surface. When forming the first cap layer, a local defect is introduced into the first cap layer, and the local defect is positioned in a place corresponding to the substantial topography variation, and the local defect is suitable for passing a predetermined fluid. <P>COPYRIGHT: (C)2011,JPO&INPIT |
