| 摘要 |
PROBLEM TO BE SOLVED: To provide: a resin composition for a circuit substrate having excellent storage stability and high heat resistance; and a prepreg, a laminated plate, a resin sheet, a printed wiring board, and a semiconductor device, which have high heat resistance and low thermal expansion by using the resin composition for a circuit substrate. SOLUTION: This resin composition for a circuit substrate is a resin composition for a circuit substrate comprising as essential components, (A) an epoxy resin, (B) a cyanate resin, (C) a quaternary phosphonium borate represented by formula (1) (where P is a phosphorus atom; R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>, and R<SP>4</SP>are an unsubstituted or substituted aromatic group, an alkyl group, or an alkyl group having a substituent, and may be the same as or different from each other, where each of them forms a P-C bond with the phosphorus atom; B is a boron atom; and X<SP>1</SP>, X<SP>2</SP>, X<SP>3</SP>, and X<SP>4</SP>are an unsubstituted or substituted aromatic group, an alkyl group, or an alkyl group having a substituent, and may be the same as or different from each other, where each of them forms a B-C bond with the boron atom), and (D) an inorganic filler, in which by using (C) a quaternary phosphonium borate represented by formula (1), storage stability, high heat resistance, and low thermal expansion can be imparted to the resin composition for a circuit substrate. COPYRIGHT: (C)2011,JPO&INPIT |
