| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device including an inertia sensor and ICs (integrated circuits), while reducing power consumption in the inertial sensor. SOLUTION: The semiconductor device includes a support substrate, an IC substrate and an elastic support that supports the IC substrate on the support substrate. A first electrode is formed on the support substrate, while a second electrode is formed on the IC substrate, and the first and second electrodes constitute a switch having two states of contacting and noncontacting. When the switch is brought to a first state, the motion of a prescribed function part on the IC substrate is put into a first mode; and when the switch is not brought to the first state within a certain period, the motion of the prescribed function part of the IC substrate is put in a second mode. COPYRIGHT: (C)2011,JPO&INPIT
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