发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.
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申请公布号 |
US2011140261(A1) |
申请公布日期 |
2011.06.16 |
申请号 |
US20090636696 |
申请日期 |
2009.12.11 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;CABLAO PHILIP LYNDON;TAY LIONEL CHIEN HUI;DAHILIG FREDERICK RODRIGUEZ |
发明人 |
CAMACHO ZIGMUND RAMIREZ;CABLAO PHILIP LYNDON;TAY LIONEL CHIEN HUI;DAHILIG FREDERICK RODRIGUEZ |
分类号 |
H01L23/498;H01L21/56;H01L21/768 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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