A wafer test probe for testing integrated circuitry on a die is disclosed. The wafer test probe includes a membrane core. The wafer test probe also includes circuitry within the membrane core. The circuitry within the membrane core includes at least one portion of an inductor. The wafer test probe further includes a probe tip.
申请公布号
WO2011072076(A2)
申请公布日期
2011.06.16
申请号
WO2010US59570
申请日期
2010.12.08
申请人
QUALCOMM INCORPORATED;JOSEFOSKY, JOHN, T.;TANG, YIWU;HAYWARD, ROGER
