发明名称 Manufacture method for multi-row leadless frame and semiconductor package
摘要 <p>PURPOSE: A method for manufacturing a multi-row type leadless frame is provided to form the fine pattern of an input and output terminal using an etched sheet in order to form the pattern. CONSTITUTION: A first etching is performed on each sheet(ST11). A circuit is formed after a lamination process is performed(ST12). A plating treatment and a delaminating process are performed(ST13, ST14). The sheet is cut into a strip(ST15). A semiconductor chip is mounted on a multi-row type leadless frame. An epoxy molding is performed(ST16). A lower part etching is performed(ST17).</p>
申请公布号 KR101041004(B1) 申请公布日期 2011.06.16
申请号 KR20080103390 申请日期 2008.10.22
申请人 发明人
分类号 H01L21/60;H01L23/48 主分类号 H01L21/60
代理机构 代理人
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