METHOD FOR DICING WAFER, METHOD FOR MOUNTING, METHOD FOR MANUFACTURING CHIP WITH ADHESIVE LAYER, AND MOUNTED BODY

摘要

PROBLEM TO BE SOLVED: To secure the visibility of a wafer cutting line and to simply stick an adhesive layer to each chip.

SOLUTION: A method for dicing a wafer includes: a mounting step of mounting a wafer 20 on a dicing sheet 21; a dicing step of dicing the wafer 20 into a plurality of chips 30; an adhesive layer forming step of forming an adhesive layer 31 on a surface of the wafer 20 after the dicing step; and an expanding step of expanding the dicing sheet 21, on which the wafer 20 is mounted, to separate the wafer 20 and the adhesive layer 31 into each piece.

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