| 摘要 |
PROBLEM TO BE SOLVED: To reliably mount the right amount of solder balls in a large substrate. SOLUTION: When solder balls 300 are mounted in a mounting target region of a substrate 400, the solder balls 300, which are mounted in divided regions 502 in which the whole region of the mounting target region is divided into a plurality of regions, is adsorbed onto an adsorption part 4. The absorption is released, while the adsorption part 4 is made close to the substrate 400. A mounting process in which the solder balls 300 are mounted in the divided region 502 is performed, the solder balls 300 are mounted in some divided regions 502 of a plurality of divided regions 502 in the mount target region. COPYRIGHT: (C)2011,JPO&INPIT |
