| 摘要 |
PURPOSE: A chip stack and a thermal conductivity for a 3D circuit are provided to reduce manufacturing costs and extend lifespan by improving the thermal conductivity of a semiconductor assembly. CONSTITUTION: In a chip stack and a thermal conductivity for a 3d circuit, a semiconductor layer(16) comprises a front side, a back side(24), and an opening. A thermal conductive pad(20) is formed on the circuit of a semiconductor layer. A diamond layer(22) is formed on the back side of the semiconductor layer. An electrical connection(38) is formed on the back side(37) of the diamond layer. The electrical connection is connected to the TSV(36) in order to enable heat to pass through an adjacent substrate. . |
