| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board having an electric circuit and an inter-layer connecting hole connected to each other. SOLUTION: In this method of manufacturing the multilayer circuit board, an insulating layer 20 is formed on a circuit forming surface of a substrate 10 on which a circuit 11 is formed, a hole 21 is formed in the insulating layer 20 from the outer surface to expose the circuit 11, and the hole 21 is filled with plating metal from the circuit 11 to form a metal pillar 22, and a resin film 23 is formed on the outer surface of the insulating layer 20 and the top portion of the metal pillar 22, and a circuit pattern 24 is formed by forming a groove and a hole having the depth thicker than the resin film 23 and a predetermined shape from the outer surface of the resin film 23, and the surface of the resin film 23 and the surface of the circuit pattern 24 are coated with a plating catalyst 25, and the resin film 23 is removed from the insulating layer 20, and, by performing electroless plating on the insulating layer 20, an electroless plating film is formed on the portion of the circuit pattern 24 where the plating catalyst 25 remains and the exposed portion of the metal pillar 22 to form the circuit 26 in the insulating layer 20, and further the circuit 11 and the circuit 26 are inter-layer-connected via the metal pillar 22. COPYRIGHT: (C)2011,JPO&INPIT |
