发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which an insulating member of high quality can be formed at a periphery of a semiconductor element by using a coating method and a depositing method. SOLUTION: The method of manufacturing the semiconductor device 100 includes the processes of: additionally forming an insulating film 10 made of an Si-based insulating material on a semiconductor substrate 2; forming a catalyst metal film 11 on the insulating film 10; subjecting the insulating film 10 to oxidation processing using the catalyst metal film 11 as a catalyst; forming a gate insulating film 4 by processing the insulating film 10 having been subjected to the oxidation processing; and forming an MOSFET 1 including the gate insulating film 4. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011119525(A) 申请公布日期 2011.06.16
申请号 JP20090276603 申请日期 2009.12.04
申请人 TOSHIBA CORP 发明人 ARAYASHIKI YUSUKE;SHIMIZU TAKASHI
分类号 H01L21/316;H01L21/283;H01L21/76;H01L29/78 主分类号 H01L21/316
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