发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which an insulating member of high quality can be formed at a periphery of a semiconductor element by using a coating method and a depositing method. SOLUTION: The method of manufacturing the semiconductor device 100 includes the processes of: additionally forming an insulating film 10 made of an Si-based insulating material on a semiconductor substrate 2; forming a catalyst metal film 11 on the insulating film 10; subjecting the insulating film 10 to oxidation processing using the catalyst metal film 11 as a catalyst; forming a gate insulating film 4 by processing the insulating film 10 having been subjected to the oxidation processing; and forming an MOSFET 1 including the gate insulating film 4. COPYRIGHT: (C)2011,JPO&INPIT
|
申请公布号 |
JP2011119525(A) |
申请公布日期 |
2011.06.16 |
申请号 |
JP20090276603 |
申请日期 |
2009.12.04 |
申请人 |
TOSHIBA CORP |
发明人 |
ARAYASHIKI YUSUKE;SHIMIZU TAKASHI |
分类号 |
H01L21/316;H01L21/283;H01L21/76;H01L29/78 |
主分类号 |
H01L21/316 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|