| 发明名称 |
BONDING METHOD AND RESIN MEMBER BONDED THEREBY |
| 摘要 |
By performing thermal fusion bonding in the state where a bonding portion is covered with a bonding portion cover and the concentrations of oxygen and moisture inside the bonding portion cover are set lower than the concentrations of oxygen and moisture in the atmosphere, it is possible to reduce elution from a bonded resin-based pipe.
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| 申请公布号 |
US2011139334(A1) |
申请公布日期 |
2011.06.16 |
| 申请号 |
US201113034504 |
申请日期 |
2011.02.24 |
| 申请人 |
TADAHIRO OHMI |
发明人 |
OHMI TADAHIRO;TSUKAMOTO KAZUMI;SHIRAI YASUYUKI |
| 分类号 |
B29C65/78;B32B37/02;B29C65/00;B29C65/02;B29C65/16;B32B37/06;B32B37/08 |
主分类号 |
B29C65/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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