| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board such that a surface mounting component is not thermally damaged even when irradiated with a laser beam to be soldered. SOLUTION: The printed wiring board 1 includes a transparent substrate 3, a top wiring pattern 4, and a reverse wiring pattern 5. The top wiring pattern 4 is formed on a top surface of the transparent substrate 3. The reverse wiring pattern 5 is formed on the reverse surface of the transparent substrate 3. A plurality of lands 41 of the top wiring pattern 4 are arranged in a predetermined region 100 along the surface mounting component 2 mounted on the top surface of the transparent substrate 3, and a plurality of lead terminals 7 of the surface mounting component 2 are soldered respectively. Wiring of the reverse wiring pattern 5 is arranged not in a region between the lands 41 in the predetermined region 100 so as to face the lands 41. The region between the lands 41 is irradiated with the laser beam, which penetrates to the reverse side without being reflected by the reverse wiring pattern 5 even when transmitted through the transparent substrate 3. COPYRIGHT: (C)2011,JPO&INPIT
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