PRODUCTION METHOD FOR HIGH PURITY COPPER POWDER USING A THERMAL PLASMA

摘要

The present invention relates to a production method for a high purity copper (Cu) powder material used, by way of example, in penetrator liners and the production of sputtering targets in the electronics industry. As regards the way in which it is consequently configured, the present invention comprises a method for producing a metal powder by using a device having a starting-material supply unit, a plasma torch unit and a reaction vessel, wherein high purity copper powder with a mean particle size of from 5 to 300 µm is obtained by making a copper (Cu) powder having a mean particle size of from 30 to 450 µm pass via a thermal plasma torch at an injection rate of from 2 to 30 kg/hr.