| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a method for mounting a semiconductor device capable of securing stable reliability. SOLUTION: The structure for mounting the semiconductor device includes a semiconductor chip 1, a mounting substrate 2 disposed to face the semiconductor chip 1 and to which the semiconductor chip 1 is connected through a solder ball 4, an underfill material 5 filled between the semiconductor chip 1 and the mounting substrate 2, a fillet part formed so that the underfill material 5 protrudes from between the semiconductor chip 1 and the mounting substrate 2, and reaches on the side surface of the semiconductor chip 1, and an incised part 5a provided to the fillet part and in which the underfill material 5 is segmentalized. COPYRIGHT: (C)2011,JPO&INPIT |
