发明名称 |
METHOD AND APPARATUS FOR CONVEYING SUBSTRATE CARRIER WITHIN ELECTRONIC DEVICE MANUFACTURING FACILITY |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for conveying a substrate carrier within an electronic device manufacturing facility. SOLUTION: A method for conveying a substrate carrier within an electronic device manufacturing facility includes: a step 205 of receiving a request to convey a carrier from a first substrate loading station to a second substrate loading station in an electronic device manufacturing facility including a plurality of carrier supports coupled to a conveyor system carrying the carrier and a plurality of substrate loading stations; a step 207 of assigning one of the plurality of carrier supports to convey the carrier from the first substrate loading station to the second substrate loading station such that at least a time required for the conveyance is reduced and balance of the conveyor system is maintained; a step 209 of carrying the carrier from the first substrate loading station; and a step 211 of carrying the carrier to the second substrate loading station. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011119749(A) |
申请公布日期 |
2011.06.16 |
申请号 |
JP20110005341 |
申请日期 |
2011.01.13 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
BRILL TODD J;TEFERRA MICHAEL;PURI AMIT;JESSOP DANIEL R;WARNER GLADE L;DUFFIN DAVID C |
分类号 |
H01L21/02;B24B5/00;B65G49/00;H01L21/00;H01L21/677 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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