| 摘要 |
<p>A method for cooling power electronic devices such as IGBT's. The method comprises placing the IGBT board in a containment structure and flooding the containment with circulating liquid refrigerant. The liquid refrigerant is boiled within the containment and the resulting gas is then removed for continued circulation within a heat engine. The phase change of the refrigerant provides excellent cooling properties. In addition, the ability to place the cooling medium directly over the IGBT's themselves represents a significant advantage.</p> |
