ELEMENT HAVING CIRCUIT PATTERN AND BURIED PRINTED CIRCUIT BOARD USING SAME AND EACH FABRICATION METHOD THEREOF

摘要

PURPOSE: A circuit pattern formation member, an embedded printed circuit board, and a manufacturing method thereof are provided to form a micro circuit pattern by improving uniformity of a thickness of the circuit pattern. CONSTITUTION: A circuit pattern formation member includes a base substrate(110) and a circuit pattern layer(140). A width ratio of upper surface/lower surface of the circuit pattern layer is greater than or equal to 40% and less than or equal to 100%. The circuit pattern layer is formed by laminating two or more metal layers in which substances of adjacent metal layers are different from each other. The metal layer is a Cu layer, a Ni layer or a Cr layer.