SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To secure a high yield by stably forming a protective film terminated at the predetermined position of a semiconductor film side surface exposed by forming element separation grooves for partitioning a discrete semiconductor light-emitting device.

SOLUTION: A method for manufacturing a light-emitting device includes: forming a semiconductor film 20 on a substrate for growth, forming element separation grooves reaching the substrate for growth on the semiconductor film 20; and also forming a protective film 50 partially covering the side surface of the semiconductor film 20 exposed by forming the element separation grooves and being apart from the substrate for growth. A process for forming the element separation grooves includes: a first etching process etching the semiconductor film 20 so that an inclined angle of the exposed surface by etching to the main surface of the semiconductor film 20 has a first inclined angle; and a second etching process forming the exposed surface having a different inclined angle by etching the semiconductor film 20 after the first etching process so that an inclined angle of the exposed surface by etching to the semiconductor film 20 has a second inclined angle greater than the first inclined angle.

COPYRIGHT: (C)2011,JPO&INPIT