发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which uses a plurality of substrate holding tools and verifies a holding condition of a substrate even if the transfer/collection position is not just under the reaction furnace, collects a normal substrate from one substrate holding tool when the one substrate holding tool detects failure and also collects the normal substrate from the other substrate holding tool. SOLUTION: The substrate processing apparatus includes a plurality of substrate holding tools 21a, 21b to hold a substrate 7, a reaction furnace 11 for conducting a predetermined process to the substrate 7, a substrate transfer device 41 to transfer and collect the substrate 7 for the substrate holding tools 21a, 21b, an identifying means for identifying the substrate holding tools 21a, 21b, a detecting device for detecting the holding condition of the substrate 7, and a control device for controlling the substrate transfer device 41. When the detecting device detects failure with the substrate 7, the control device collects the substrate 7 with the substrate transfer device 41 based on the detected holding condition of the substrate 7 and the identification result of the identifying means. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011119504(A) 申请公布日期 2011.06.16
申请号 JP20090276331 申请日期 2009.12.04
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TANIUCHI MASAMICHI
分类号 H01L21/677;C23C16/44;H01L21/205;H01L21/3065;H01L21/31;H01L21/683 主分类号 H01L21/677
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