发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACKABLE PACKAGE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a base assembly having a cavity and a through conductor adjacent to the cavity; connecting a first device to the base assembly with the first device within the cavity; connecting a second device to the base assembly with the second device within the cavity; and connecting an interposer substrate having an exposed external side over the through conductor with the exposed external side facing away from the through conductor and exposed to ambient.
|
申请公布号 |
US2011140283(A1) |
申请公布日期 |
2011.06.16 |
申请号 |
US20090639990 |
申请日期 |
2009.12.16 |
申请人 |
CHANDRA HARRY;MARTIN III ROBERT J |
发明人 |
CHANDRA HARRY;MARTIN, III ROBERT J. |
分类号 |
H01L23/52;H01L21/50 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|